Rise Above Ambient Temp. (c)
	Mfg.	Model	27mm large copper block	15mm small copper block		27mm large copper block	15mm small copper block
			50W	50W		100W	100W
1	Thermal Integration	TI-V77L	12.6	17.9		31.0	37.1
2	Vantec	CCK-6027D	18.0	22.2		37.5	46.0
3	OCZ	Dominator	11.2	24.4		25.9	47.7
4	Akasa	Silver Mountain	19.6	24.9		38.4	49.5
5	Vantec	CCK-6035D-Retail	17.7	26.3		36.7	51.4
6	Thermaltake	Volcano 6cu+	13.8	28.8		32.1	57.9
7	Spire	5T060B1H3R	16.0	30.8		37.9	58.4
8	Fortis	A92	18.9	39.1		41.1	71.1
			50W	50W		100W	100W

One of the greatest aspects of this design is the use of waste exhaust air to cool the surrounding surfaces of the very heat source warming up everything. In the case of a processor, exhaust air is blown directly down on to the PCB or ceramic where it has a chance to cool the areas surrounding the core - a definite plus and probable explanation as to why the Thermoengine design gets such good thermal scores everywhere.

The TI-V77L holds its own for the most part on both sets of interface dies and at both heat loads. It looses out to the Dominator on the large interface die test for both wattages however. Again, for its design it makes very efficient use of all air motion over its fins, but with its' relatively small mounting surface can beat out all the competition.

Performance freaks with bad hearing will be delighted to know that the TI-V77L extrusion can even accommodate 60mm Delta fans (provided you have the right kind of screws to bolt the thing on) should you want to upgrade to something a little faster. Personally, with temperature results this good, why bother?