360° View - Thermaltake ISGC-300 Heatsink Information on Frostytech's test methodology is available here.
The 120mm fan spins at 800-1300RPM and draws power from a standard 3-pin motherboard fan header. A fan speed controller is attached to the power cable. The four copper heatpipes are 6mm in diameter, and extend from the base up through all the swaged aluminum fins. Each raw aluminum fin measures 0.4mm thick and is spaced 2.5mm apart. With the 120mm fan removed you can clearly see the wide spacing between the fins - this is a very simple heatsink by all standards.
The Thermaltake ISGC-300 heatsink stands 160mm tall, the bottom fin is 49mm above the CPU socket for clearance of motherboard components. The four copper heat pipes are positioned side to side where they make contact with the processor and soldered to a 2mm thick copper plate. The footprint of this particular cooler is 126x92mm. The fan can be attached to either side of the ISGC-300, but only one pair of springy wire clips are supplied.
The copper base plate on the Thermaltake ISGC-300 measures 36 x 38mm in size. The heatpipes are grouped towards the outer edges of the aluminum fin array so they are in the path of the highest velocity airflow from the 1300RPM fan.