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Synthetic Temperature Test Results: *Ranked according to 100W small interface die test results.
Considering that this is an aluminum extrusion heatsink with a copper base plate attached by screws (ie. with standard thermal compound for the interface material) it is not all that surprising that the heatsink falls down towards the middle-to-lower end of the list of reference heatsinks.
In the end, the final rise above ambient test results illustrate that the Foxconn Generic heatsinks is middle of the road heatsink for socket A platforms. The cooler is equipped with a small fan that produces little noise.... and little airflow comparable to some other fans in this list. The heatsink is not very large, but the addition of a copper base plate should theoretically widen its application range. In reality, the copper base plate is not as good as if the heatsink and heatspreader were bonded via a metal-to-metal process. The thermal interface material is not as conductive as pure metal, even solder, and any voids which may exist between the copper and aluminum will undoubtedly impair the cooling ability of the heatsink. Remarkably, the temperature results for the Foxconn heatsink were better than we had anticipated, and it does present itself as an average heatsink for OEM level applications. Given the options available to consumers these days, it would be a wise choice to consider swapping this heatsink out for something with a little more potential. Of course, if systems which are currently using this heatsink are experiencing no heat problems then it is fine to leave the heatsink right where it is. If you are looking for more cooling performance however, consider stepping up to a heatsink which is slightly more current in design, and not simply adapted to stay within processor thermal guidelines. Related Articles:Here are a few other articles that you might enjoy as well... 1. CpuMate DAA11500 Copper Socket A Heatsink
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