Thermal Integration TI-T707TN Heatsink From All Angles
	The Fans: The seven bladed YS Tech fan is thermally controlled so that at 33C the fan's RPM will start to increase. At lower temperatures the fan is very quiet, but when brought up to full speed it was somewhat noisy. The fan is 70mm in size and hooks up to a standard 3-pin motherboard fan header.
	Bare Heatsink: The copper core at the heart of this heatsink measures 31mm in diameter, and is 25mm thick. The center portion of the aluminum extrusion is cut out to depth of 11mm leaving a nice large 45mm space on the top of the heatsink. This space is a more efficient use of material than bringing the copper and aluminum all the way to the top, and also helps to alleviate the dead spot that occurs under every fan motor (there is practically no airflow there).
	Side A: From the side we can see the small fold in the fan shroud for the clip to pass over - this prevents the compression clips from sliding off. The fan is 25mm thick, and 70mm in size. The heatsink is about 35mm tall and the fins spaced 2.5mm apart at the outer circumference.
	Side B: From the wide side, the TI-T707TN looks practically the same.
	Heatsink Base: The base of this copper and aluminum heatsink is very nicely finished - the copper is completely flat and smooth. There are no visible machining marks and the copper is very slightly elevated above the surrounding aluminum extrusion. The thermal capabilities of the heatsink depend a great deal on the type of interface that exists between the copper and the aluminum. Ideally, the aluminum should not be anodized where it contacts the copper, and both surfaces tightly toleranced.