Noise levels are really not much of an issue with 1U coolers as SCSI drives, case fans and whatnot produce a lot more noise inside the server than any processor cooling solution is likely to. Still, if you would like to listen to this heatsink click on the headphones.

Synthetic Temperature Test Results: *Ranked according to 100W small interface die test results.

1U - FrostyTech Synthetic Temperature Test Platform Results
	Mfg.	Model	Ambient Temp.	27mm large copper block	15mm small copper block		27mm large copper block	15mm small copper block	Thermal pad	No. Fans	Fan Noise	Clip force
				50W	50W		100W	100W
1	Arkua	6149	23.2	50.9	53.1		81.2	81.4	silver	1	low	med
2	Dynatron	DC1206BMR	23.8	51.0	56.5		80.6	86.8	silver	1	med	stiff
3	Spire	5R057B1M3R	23.0	44.9	69.7		66.4	89.7	silver	1	med	easy
4	Vantec	FCE-6010	25.6	70.7	72.4		111.3	116.9	silver	1	low	stiff
				50W	50W		100W	100W

The initial results for the FCE6010 should be seen in two different lights. The results for the cooler on the 50W heat load show it coming in last for our set of reference coolers, but not out of scale. This all changes when we move to the higher power 100W test.

Here the FCE-6010 is obviously out of its design specs, and is just suffers under 120C temperatures. This is one of the first heatsinks we have seen that broke the 100 C barrier on out test platform, and one that broke by quite a substantial amount. This should give you a good idea of how well heatsinks work that an keep their 100W test temperatures in the low 50's or even 40's.

1U - Rise Above Ambient Temp. (c)
	Mfg.	Model	27mm large copper block	15mm small copper block		27mm large copper block	15mm small copper block
			50W	50W		100W	100W
1	Arkua	6149	27.7	30.0		78.0	58.2
2	Dynatron	DC1206BMR	27.2	52.7		56.8	63.0
3	Spire	5R057B1M3R	21.9	46.7		43.4	66.7
4	Vantec	FCE-6010	45.1	46.8		85.7	91.3
			50W	50W		100W	100W

Okay so the rise above ambient temperatures are a little bit more forgiving and better represent the limitations of the FCE-6010. On the 50W test it comes in just behind the all copper Spire cooler, and above that of the Dynatron. On these types of heat loads the FCE-6010 is about average. Before we more to the 100W test results also notice the elevated temperatures on the large interface die for the 50W test - the FCE-6010 is just too far out of range.

On the 100W test the large interface die again shows the limitations of this cooler, it simply doesn't have the necessary requirements to cool the large interface die to acceptable levels. The situation is elevated even further on the small interface die where the temperature reaches 91C. This is very far out of spec and leaves us to the conclusion that the only acceptable application for the FCE-6010 is on small die chips that produce less than 50W. Any other applications are just too far out of spec and not a good idea.