Spire 5E34B3 Cu-Baseplate Heatsink Review

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The Spire 5E34B3 is one of the few heatsinks we have seen to have a copper plate mounted on the base of it. The extruded aluminum portion of the heatsink is fairly large, and seems to be well designed from the outset.

The confusing part may come if you happen to be looking for this heatsink in a store, as it can be under any one of a number of names. On the web, you'll be able to find this heatsink located at the Speeze and Spire websites - the names of the parent companies heatsink brands. The box for this cooler is labeled Jamitech, but it can also be under Fanner Tech Co. All these names are the same company, and for the purposes of clarity, we will be calling this heatsink by its Spire name since this brand is familiar to us here.

Designed for: AMD Athlon, Duron. Intel FC-PGA, PGA. VIA Cyrix III.

Heatsink Specs: HS Model: 5E34B3 Fan: FTC FD06015B1M Fan Spec: 4500RPM, 12V, 0.17A, ball bearing Fan Dim: 15x60x60mm HS Dim: 51x70x65mm HS Material: extruded aluminum and copper plate Mfg by: Fanner Tech Co. Cost: unknown Sold By: Spire.com

The copper base plate is 4mm thick and attached to the base of the aluminum extrusion by two screws which hold it in place. The area between the copper and aluminum is filled with a silicon-based thermal compound in an effort to improve thermal conductivity. Were the Aluminum and copper to be bonded in the same fashion as the alpha heatsinks there would undoubtedly be less thermal resistance to cope with. Still it seems to be a fairly unique solution to spreading the heat over a larger surface area.