Needless to say the results of our tests on the synthetic temperature test platform with the Titan TTC-MS2AB were less that reassuring. The Titan scored very high temperatures relative to our six other reference heatsinks. When testing with the small copper die template (the most important of the two die templates) the readings went beyond the range of our digital thermometer.

Perhaps, if the Titan were given a good lapping it might be capable of performing better, but as it stands we were less than comfortable with its performance.

Conclusions:

There are a couple of factors concerning the manufacturing of the Titan which could be implicating negatively on the performance characteristics of the heatsink. First off, the machining process to remove material for the fan causes the fins closest to the central core to be bent slightly. The end result of this "skewing" is the closing off of the region directly behind the fan blades.

There is no doubt that constricting the spacing between the fins in this region would have and adverse affect on the airflow over the remaining surface area.

Additionally the surface finish of the base is quite rough. While this may not matter as much with larger, heatspreader covered processors, the smaller silicon die processors will have greater difficulty transferring thermal energy to the body of the Titan heatsink.

It's an interesting design adaptation, but one which has several areas which need to be improved upon before it can become competitive.