The Everflow fan is not going to be one that you've probably heard of before. It performs quietly and moves roughly 36CFM of air down onto the staggered fins of the Volcano II. The fan is not very loud at all. This is a good thing when you consider the noise output by several of Vantec's higher-performance heatsinks. An RPM lead allows the motherboard to monitor the fan's speed and alert you in the event of a stall.
	Taking off the fan shows more of the framework Thermaltake have designed to hold the fan securely in place. Rather than just sending a few screws into the tops of the fins, the frame gives the fan about 5-10mm stand off. Due to the stepped design of the Volcano II's fins, attachment via the more traditional manner would probably not be possible anyhow.
	Here the stepped fins are more visible. In other designs the height of the fins remains constant along the entire length. In the design of the Volcano the outer-most fins have been stepped to promote more movement of the slower moving air. The fins are about 0.9mm thick at the base and taper towards the top for a final width of about 0.6mm. Fin spacing is set at 2mm. Also note how thick the base of the Volcano II is. Most heatsinks we've seen recently lack the 6mm thick base that this heatsink has.
	The surface of the bottom of the Volcano II looks a bit on the rough side but is almost perfectly flat. The few marks you can see from the extrusion are inner, and thus won't really affect the processor from seating properly if the Thermagon pad is removed. During our tests, we removed the thermal pad and used instead a small amount of AOS thermal compound.

Time to test the Volcano II against a few other heatsinks and see just how well it performs... especially against the venerable SuperORB. But first, a little explanation on how we set about testing our heatsinks via a synthetic heat source.