Both the Wakefield and GC Electronics thermal compounds are pretty generic. They performed fairly well, though I don't have their thermal conductivity's to compare with the AOS stuff. When we had the CopperSink on the test platform with no thermal compound at all, the internal thermistor went off the scale which was +70 C. A little thermal compound brought about a +10 C drop in temperature, with the HTC-60 exhibiting a drop of +14 C.

On average the non-silicon thermal compounds performed better than the silicon variety, except for the 52029KY batch. It was very strange to see it actually perform worse than 52022,  and it did appear to be very thin, so perhaps it was a bad batch. Either way, the HTC-60 is the clear winner in terms of the AOC non-silicon thermal compounds. It's resistance to drying out is a major plus, but its mild abrasiveness is not to great for bare silicon. Use sparingly if you try it out, and hope it doesn't abrade the die too much.