FrostyTech Mk.III Synthetic Thermal Heatsink Test Results Intel Core i7, Extreme Edition class heatsinks tested at a 200W heat load. Results based on readings from a 38x38mm copper interface die with 200W heat load on the Intel version of the Mk.III Test Platform. Temperature results listed for each heatsink were calculated by determining the rise over ambient temperatures at time of test. Information on Frostytech's test methodology is available here. Socket LGA2011/1366 compatible CPU heatsinks
manufacturer:	model no.:	*fan speed:	200w thermal test (°c)	noise level (dba)
Coolermaster	Nepton 280L	high	10.6	58.8
Coolermaster	Nepton 140XL	high	11.8	59.6
Coolermaster	Seidon 240M	high	13.4	55.6
Silverstone	Tundra TD02	high	13.6	53.0
Coolermaster	Glacer 240L	high	14.1	52.5
NZXT	Kraken X60	high	14.5	60.7
Noctua	NH-U14S		17.0	47.3
Coolermaster	Seidon 120V	high	17.5	54.3
NZXT	Kraken X40	high	18.2	59.4
Silverstone	Tundra TD03	high	18.7	58.1
Silverstone	Argon AR01	high	18.8	53.0
Coolermaster	Eisberg 240L	high	19.1	50.5
Raijintek	Themis	high	19.7	52.8
Coolermaster	V8 GTS	high	20.0	59.7
Corsair	Hydro H80i	high	21.1	64.0
Noctua	NH-U12S		21.1	46.2
Raijintek	Ereboss	high	21.4	49.7
Zalman	Reserator 3 Max	high	21.6	58.9
Scythe	Mugen 4	high	21.7	41.9
Zalman	LQ315	high	21.9	50.8
Silverstone	NT06-P	high	22.1	51.6
Raijintek	Aidos	high	23.0	55.6
Zalman	LQ310	high	23.8	52.7
Zalman	LQ320	high	25.5	50.2
Dynatron	G556 (LGA1366/2U)		29.1	68.4
Dynatron	G555 (LGA1366/2U)		30.4	67.8
Dynatron	G666 (LGA1366/2U)		31.8	68.7
Silverstone	NT01-Pro	high	35.8	40.4
nPowerTek	NPH1366-140HC (LGA1366)	high	36.3	48.1
Dynatron	G199 (LGA1366/1U)		47.6	62.6
			200w thermal test (°c)	noise level (dba)
*heatsinks are ranked according to the 200w thermal test results column (rise over ambient temp.). low temperatures with low noise levels are considered best. for reference heatsinks with variable-speed fans, only the high speed (12v) fan test result is included in the comparison sheet; more detailed results reside in each specific heatsink review.

Frostytech's socket LGA2011 Intel synthetic thermal test platform stresses socket LGA2011/LGA1366 compatible heatsinks with a 200W heat load. Keep in mind that the AMD Integrated Heat Spreader and Intel LGA2011 Integrated Heat Spreader both measure ~38x38mm, so these test results can be extrapolated to AMD processor scenario's as well.

With a 200W heat load applied by the Intel LGA2011/1366 version of FrostyTech's synthetic thermal test platform, the Dynatron G555 2U Xeon server heatsink is able to maintain a satisfactory temperature result of 30.4°C over ambient, at 5500RPM fan speed.

Working within the very restrictive envelope of a 2U server chassis doesn't leave a lot of room to innovate; there are fixed volumes a heatsink can occupy so bigger fans and more cooling surface area simply can't be added when greater cooling performance is demanded. Dynatron have produced a workable 2U server thermal solution for the LGA1366 platform, but the Dynatron G555 is hardly what we'd call innovative. The way the aluminum fins and copper heatpipes are bonded to the copper base plate is less than ideal; a patch of thermal adhesive is not as effective as linearly soldered surfaces. The fan is very loud, which is acceptable in a server environment, I suppose, but much of the airflow is lost outside the aluminum fins... for adjacent component cooling we suspect.

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