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Spire Fourier IV SP607B3C Heatsink Review
Spire Fourier IV SP607B3C Heatsink Review
  65%   
Abstract: Spire's Fourier IV SP607B3-C is a heavy heatsink, and it installs with very secure mounting hardware that is quite inconvenient.

 Manufacturer  Category  Published  Author 
Spire   Cooling / Heatsinks   Sep 04, 2007   Max Page  

Home > Reviews > Page: 360° View - Spire Fourier IV SP607B3C heatsink
360° View - Spire Fourier IV Heatsink
Information on Frostytech's test methodology is available here.

The Heatsink Fan:
The 92x92x25mm fan on the Spire Fourier IV spins at 3500RPM behind the copper fins as seen from the top down. Noise levels sit at about 60 dBA according to Frostytech's real world should level measurements. The fan connects via a 3-pin motherboard fan header, no fan speed controller is included. The translucent blue 7-bladed fan impeller is no internally illuminated.

Heatsink Side A:
The copper fins are soldered to the four copper heatpipes, and each fin is about 0.3mm thick. Fins are spaced 1.5mm apart, and measure approximately 125x39mm in size. Wire clips rest on the edge of the copper fins to hold the 92mm fan in place below. The fan exhausts air up from the bottom of the copper fins and out the top of the heatsink.

Heatsink Side B:
The Spire Fourier IV stands 97mm high, with about 45mm of that space set aside for the fan. The bulk of the heatsink is elevated 56mm above the base (to the copper fin), so there is good clearance for adjacent capacitors and the like. The wave design of the fins is nice, but in testing we saw mixed results from this cooler. At the base, four copper heatpipes are set within 8mm thick copper base.

Heatsink Side B:
The four 6mm diameter heatpipes make two right angle turns before meeting the copper cooling fins. The design concept here seems somewhat inefficient, irrespective of all the copper utilized.

Heatsink Base:
The copper base of the Spire Fourier IV heatsink has a sanded finish which is flat in box axis. The portion of the base that makes contact with the CPU integrated heatspreader measures 37x37mm, and is at least 6.5mm thick on average. Surface roughness is at or better than ~63 microinches, which is considered satisfactory. Note the screws holes at each corner for attaching the two metal mounting brackets.

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Table of Contents:

 1:  Spire Fourier IV SP607B3C Heatsink Review
 2: — 360° View - Spire Fourier IV SP607B3C heatsink
 3:  Acoustic Comparisons and Base Surface Quality
 4:  AMD K8 Heatsink Temperature Comparisons
 5:  Intel 775 Heatsink Temperature Comparisons

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