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VIA striking deeper - VIA striking deeper
Thu Mar 22, 2001 | 6:50P| PermaLink
TAIPEI, Taiwan - Hoping to strike deeper into the CPU market, Via Technologies will officially unveil its second generation microprocessor at two upcoming conferences - CeBit (Hannover, Germany) March 25 and WinHEC (Anaheim, Calif.) March 26. And based on tests claiming that it performs equitably against Intel's Celeron on commonly used 2D applications, the company believes it can win 5 to 7 percent market share this year.To reach such an ambitious goal, Via is sinking deeper roots into emerging markets like China and India, where it hopes to exploit cracks in the global strategies of Intel and Advanced Micro Devices. Key to its plans will be pushing Information PC designs that bundle the Via Cyrix III, based on the new Samuel 2 core, with the Via Apollo PLE133 chip set and its integrated AGP 3D/2D graphics core. The new Samuel 2 core is the scrappy Taiwanese company's effort to arm itself anew to do battle for the low end of the PC market with Intel and AMD. The 1.5-volt, 750-MHz chip will be quickly followed by an 850-MHz version. Both will be made with a 0.15-micron process, use a 133-MHz front-side bus and feature 64 kbytes of L2 cache, which the company says will boost performance by 10 to 30 percent over its predecessor. The Samuel 2 is expected to ship in volume this summer and to have a footprint of 52 mm2. Around the same time, Via predicts it will have a 1-GHz version ready for sampling, which will be made with a 0.13-micron process.

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