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Taiwan thermal module makers expanding heat-pipe capacities - FrostyTech.com Taiwan thermal module makers expanding heat-pipe capacities
Fri Apr 25, 2014 | 5:01P | PermaLink BY: Max Page
"Major Taiwan-based thermal module makers expect fast growing demand for thin heat-pipes from smartphone and tablet vendors, and are expanding production capacities in preparation to start shipments in the second half of 2014, according to Taiwan-based equipment makers.

Sony Mobile Communications took the initiative to adopt thin heat-pipes for its Xperia Z2 smartphone, and Samsung Electronics and HTC are expected to follow suit, Taiwan-based supply chain makers indicated.

While graphite plates have so far been used to dissipate heat in smartphones and tablets, copper-made thin heat-pipes carry the same production cost but have higher heat-dissipation efficiency, the makers said. As LTE smartphones support higher data transfer capabilities, demand for heat dissipation is accordingly higher, which is the main reason for using heat-pipes, the sources noted."

FULL STORY @ DIGITIMES
(http://www.digitimes.com/news/a20140425PD208.html?mod=2)

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Time stamped: 3:49PM, 09.19.2014



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