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Dynatron R25 Server Heatsink - FrostyTech.com Dynatron R25 Server Heatsink
Wed Aug 07, 2013 | 12:59P | PermaLink BY: Max Page
www.frostytech.com

Designed for demanding server applications, the Dynatron R25 heatsink uses an innovative vapor chamber to bring forth superior thermal performance via radiant heat transfer over that of solid copper and heatpipe designs. The R25 is an ideal thermal solution for low-profile high-density application with small heat source surface.

For superior airflow an 80x15 mm in diameter, aluminum PWM blower powers the R25 providing unmatched heat dissipation to push Intel® Sandy Bridge Socket LGA 2011 Narrow ILM Processors cooling performance to new levels. The Dynatron R25 heatsink is specifically engineered to have a lightweight design to ensure it meets mechanical shock and vibration requirements in 1U server applications.

Dynatron's R25 server CPU cooler provides a maximum of 160W TDP cooling power for 1U server solution and allows airflow up to 22.28 CFM with full 7000RPM fan speed. The R25 features pre-printed Shin-Etsu G751 high conductivity thermal compound to make installation easy and to ensure perfect
contact between the copper base and CPU for excellent heat conduction.

Specifications:
• CPU Socket: LGA2011 (Narrow Type, 56 x 94mm mounting pitch )
• Supports Intel Sandy Bridge ES-2600 & 4600 Series Processors up to (for Narrow ILM Mounting Only ) up to160 Watts
• 1U server solution
• Dimensions: 106.0 x 84.0 x 27.5 mm
• Weight: 470 Grams
• Copper based material with vapor chamber heatsink and copper stacked fin
• Fan dimension 80 x15mm diameter
• Speed at duty cycle; 20%: 1000 RPM, 50%: 3500 RPM, 100%: 7000 RPM
• Pre-printed thermal compound: Shin-Etsu G751

FULL STORY @ DYNATRON-CORP
(http://www.dynatron-corp.com/en/product_detail_1.aspx?cv=&id=261&in=0)

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Time stamped: 7:31PM, 04.23.2014



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