"Commenting on Intel's reported plans of abandoning CPU socket designs and changing to directly soldered CPUs after two years, Asustek Computer vice president and general manager of motherboard/desktop business Joe Hsieh has said that the issue will not be as bad as people think, and Intel is likely to adopt a strategy to allow the both methods to coexist.
Hsieh noted that even if Intel's ball grid array (BGA) packaging plans enter the desktop industry, the industry will continue to live on as motherboard makers will figure out how to handle and respond to the change.
Other motherboard players also believe that Intel is unlikely to suddenly change its CPU designs from LGA to BGA packaging since PC processors are still a major profit contributor to Intel. But even without any impact from the reported BGA plans, the PC DIY market continues to face issues of decline."
