A while back FrostyTech reviewed several of CoolLink's heatsinks and found them to be generally well performing, if a little rough around the edges. During Computex in Taiwan, we stumbled upon some new watercooling blocks that CoolLink was displaying. As of yet there is no indication that any of these full-copper water blocks have been released, but given that the majority are just the right size for videocard GPUs or Northbridge chipsets, such designs would be eagerly anticipated.

An assortment of copper water blocks for GPUs and CPUs made by CoolLink. The units on the left are fairly standard designs, while the prototype model on the right involves a double loop pattern in an effort to increase surface area.

This CoolLink GPU or chipset block on the left is milled from copper, and includes some rather simple geometry in the flow chamber to induce turbulence. The company also exhibited a collection of small plexiglass and aluminum fluid reservoirs.

Two copper CoolLink heatsinks for the K8 AMD and Intel socket 478 Pentium 4 platform. The stacked copper fins are soldered to thicker copper base. The inverted triangular cut out is intended to improve air flow under the fan motor, and reduce the formation of hot-spots.

These two CoolLink heatsinks are a good example of how one heatsinks' copper fin design can be adopted for use on multiple processor platforms only by just changing the mounting mechanisms. On the left is the AMD Athlon64 socket 754/939/940 version, and on the right is essentially the same heatsink configured for socket 478 Intel Pentium 4 processors.

Yet another iteration of this exact same CoolLink heatsink was produced for socket A AMD AthlonXP CPUs. Such diversification can lead to thermal problems as the differing surface area of each specific processor core cannot necessarily be cooled with one-size fits all designs... this is unfortunately something FrostyTech see all to much of.