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Glacialtech Igloo 5063 Cu Silent E Heatsink Review
Glacialtech Igloo 5063 Cu Silent E Heatsink Review
Overall Rating:   76%
Abstract: This Intel socket 775 heatsink is made of extruded aluminum with a 28mm copper core at the center, the copper base has a pre-applied patch of Shin-Etsu thermal compound applied.

 Company link     Category     Published     Author    
Glacialtech   $$ Price It! ££ Cooling / Heatsinks   Aug 29, 2008   Max Page  


Heatsinks for low wattage energy efficient processors have been the topic of the last couple Frostytech reviews. The trend continues today with Glacialtech's new Igloo 5063 Cu Silent E heatsink. The Igloo 5063 Cu Silent is a variant of the Igloo 5063 model, with the addition of a copper slug at the center and a slower speed fan to decrease noise levels dramatically. Basically, Glacialtech made this heatsink a little beefier so it could slap on a quieter lower RPM fan. The copper doesn't make this an overall cooler heatsink, it simply allows it to maintain performance with less noise.

As such the Glacialtech Igloo 5063 Cu Silent is potentially suitable to low profile media center type computer systems. The heatsink has a maximum design spec of 95W, but as we've been seeing, this family of Glacialtech heatsinks are best suited to sub-85W processors in the 65W and 35W range.

This Intel socket 775 heatsink is made of extruded aluminum with a 28mm copper core at the center, the copper base has a pre-applied patch of Shin-Etsu thermal compound applied. It ships with an 80mm fan that spins at a leisurely 2000RPM, weighs about 450grams and stands 67mm tall. According to the manufacturer it is suitable for CPUs outputting 95W heat or less.

Glacialtech Igloo 5063 Cu Silent E Heatsink
HEATSINK SPECSHEET
Manufacturer: Glacialtech
Model No.: Igloo 5063 Cu Silent E
Materials: extruded aluminum
Fan Mfg: Powerlogic PLA08025S12L
Fan Spec: 2000RPM, 12V, 0.10A
Fan Dim: 25x80x80mm
Heatsink & Fan Dim: 67x90x90mm
Weight: est. 450 grams
Includes: thermal compound, instructions

Compatible with Sockets: LGA775
Est. Pricing: $27USD ($27CDN)

There's not a lot else that needs to be said about the Glacialtech Igloo 5058 Cu Silent heatsink, other than to reiterate that it's best suited to smaller enclosures where vertical height is restricted, and to energy efficient processors that don't run very hot. It can be used with processors having a TDP of 95W or less.

Base Finish and Flatness

Flipping a heatsink over to inspect the business end is often a simple indicator of overall cooler quality. More practically speaking, a heatsink is in many ways only as effective as the contact it makes with the processor - the flatter and smoother the better. Base finish is one of the criteria that Frostytech measure in the course of evaluating heatsinks, and it involves two distinct aspects. Surface Finish is the first; this is calculated with the aid of Surface Roughness Comparator that has a cross section of common machine surface finishes and their numerical surface roughness equivalents in microinches. The second is Surface Flatness. This is tested with an engineers straight edge or proven flat surface, in two axis.

The base of the Glacialtech Igloo 5063 Cu Silent E heatsink has a surface roughness of ~8 microinches. The base is 28mm in diameter and perfectly flat. A patch of good quality shin-etsu thermal compound is pre-applied to the base. Here's a shot of the bare copper once the thermal compound was wiped off.

FrostyTech's Test Methodologies are outlined in detail here if you care to know what equipment is used, and the parameters under which the tests are conducted. Now let's move forward and take a closer look at this heatsink, its acoustic characteristics, and of course its performance in the thermal tests!

° Next Page 

Article Contents:
 Page 1:  — Glacialtech Igloo 5063 Cu Silent E Heatsink Review
 Page 2:  360° View - Glacialtech Igloo 5063 Cu Silent E Heatsink
 Page 3:  Sound Level Measurements: Which Heatsink is Quietest?
 Page 4:  Intel LGA775 Heatsink Temperature Comparisons

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Time stamped: 10:25AM, 08.31.2014



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