NengTyi K609 Heatsink Review

Originally developed for the socket 370 Celeron processor, the NengTyi K609 heatsink was ahead of its time. Built with a fully copper base and thin aluminum fins, the heatsink was one of the first to bridge the gap between all copper and all aluminum heatsinks.

Armed with a Nidec fan, the K609 was better equipped than many other heatsinks of this class, but as time and thermal loads have moved on, so to has the performance potential of this heatsink. What was once a good heatsinks for socket 370 celeron's is now not so hot.... or on the other hand, quite toasty. However, with a focus on low noise cooling systems and processors like the C3 from VIA, there may still be applications where a heatsink of this stature work well.

With aluminum fins and a copper base, just how well will the NengTyi K609 perform thermally given the current set of thermal tests? Let's find out!

	Heatsink Specsheet: Model: K609 Fan: 4700RPM, 13 CFM, 12V, Nidec Fan Fan Dim: 15x50x50mm Heatsink Dim: 40x58x52mm HS Material: Copper, aluminum Weight: 152 grams Sold By: www.nengtyi.com.tw

NengTyi K609 Heatsink From All Angles
	The Fan: Little 50mm fans have almost gone the way of the dinosaurs because they simply can't provide sufficient airflow for today's thermal requirements. In any case, this Nidec BetaSL fan rotates at about 4700RPM and fits perfectly on the small K609 heatsink. The fan connects to the motherboard via a three-pin connector, and supports RPM monitoring.
	Heatsink Top: With the fan removed for a moment we can see how this heatsink has been constructed. The aluminum fins have been punched out of sheet metal, folded, and bonded together with small tabs. The resulting assembly has been glued to the copper base with an adhesive. There is virtually no clearance between the tips of the fins and the base of the fan.
	Side A: From a side we can see just how low the fin density of this heatsink is - with just 18 fins in total. Each aluminum fin is 0.4mm thick and separated by 2mm of space from the adjacent fin. The cooling fins are 21mm in height and the base is 3mm thick copper. The spring clip attaches to just one of the socket tabs, but is at least tooless.
	Heatsink Base: The base has is roughly finished from the stamping process, and aside from a slight undercut is marked with a few guidelines. The green thermal interface pad turns into a waxy substance once heat is applied through the processor. The base is not smooth, though it is generally flat over the area where the processor will come in contact with the copper.