NengTyi K613 Copper Heatsink Review

---

This miniature heatsink is so small it almost counts as a 1U heatsink - except for the fact that it hasn't been designed to work in such constrained environments. Built around a full copper body, the NengTyi K613 was once intended to cool down toasty Socket 370 Celeron processors. Now a days there aren't too many of those computers floating around, let alone being built so what if any application is this heatsink suitable for?

In the next few pages we are going to take a look at one of the heatsinks to start the 'interlocking copper fin' trend. We are going to test it, poke it, and record it. At the end we should have a fairly good idea whether the K613 is still useful for any applications in the cooling world, or if it should just be retired along with those old Golden orbs.

Get ready, grab a cup of coffee and sit back as we take a look at the all copper NengTyi K613 Socket 370 heatsink.

	Heatsink Specsheet: Model: K613 Fan: 4700RPM, 13 CFM, 12V, Nidec Fan Fan Dim: 15x50x50mm Heatsink Dim: 32x51x52mm HS Material: Copper Weight: 160 grams Sold By: www.nengtyi.com.tw

NengTyi K613 Heatsink From All Angles
	The Fan: Little 50mm fans don't move all that much air, but they do spin rather quietly which is a bonus. The K613 is equipped with a Nidec BetaSL fan which is higher quality that the norm. The fan connects to the motherboard via a three-pin connector, and supports RPM monitoring.
	Heatsink Top: With the fan removed for a moment we can see how this heatsink has been constructed. The copper fins have been punched out of sheet metal, folded, and bonded together with small interlocking tabs. The resulting assembly has been glued (not soldered unfortunately) to the copper base with an adhesive. There is virtually no clearance between the tips of the fins and the base of the fan.
	Side A: From a side we can see just how thin the entire heatsink actually is. The heatsink itself is about as large as the 50mm fan. There are 18 fins in total measuring 0.4mm thick and separated by 2mm of space. The copper fins are 13mm in height and the base is 2mm thick copper. The spring clip attaches to just one of the socket tabs, but is at least tooless.
	Heatsink Base: The base has is roughly finished from the stamping process. The green thermal interface pad turns into a waxy substance once heat is applied through the processor. The base is not perfectly smooth, though it is generally flat over the area where the processor will come in contact with the copper.