NengTyi K613 Copper Heatsink Review
miniature heatsink is so small it almost
counts as a 1U heatsink - except for the fact that it hasn't been designed
to work in such constrained environments. Built around a
full copper body, the NengTyi K613 was once intended to cool down toasty Socket
370 Celeron processors. Now a days there aren't too many of those computers floating around, let alone
being built so what if any application is this heatsink suitable
In the next few pages we
are going to take a look at one of the heatsinks to start the 'interlocking copper fin'
trend. We are going to test it, poke it, and record it. At the end we
should have a fairly good idea whether the K613 is still useful for any
applications in the cooling world, or if it should just be retired along with
those old Golden orbs.
Get ready, grab a cup of
coffee and sit back as we take a look at the all copper NengTyi K613 Socket 370
Sold By: www.nengtyi.com.tw
- Model: K613
- Fan: 4700RPM, 13 CFM, 12V, Nidec Fan
- Fan Dim: 15x50x50mm
- Heatsink Dim: 32x51x52mm
- HS Material: Copper
- Weight: 160 grams
|NengTyi K613 Heatsink
From All Angles|
||The Fan: |
Little 50mm fans don't move all that
much air, but they do spin rather quietly which is a bonus.
The K613 is equipped with a Nidec BetaSL fan which is
higher quality that the norm. The fan connects to the motherboard via
a three-pin connector, and supports RPM monitoring.
With the fan removed
moment we can see how this heatsink has been constructed. The copper fins have
been punched out of sheet metal, folded, and bonded together with small interlocking tabs.
The resulting assembly has been glued (not soldered unfortunately) to the copper
base with an adhesive. There is virtually no clearance between the tips of
the fins and the base of the fan.
From a side we can see just how thin the
actually is. The heatsink
itself is about as large as the 50mm fan. There are 18 fins in
total measuring 0.4mm thick and separated by 2mm of space. The copper fins are 13mm in
height and the base is 2mm thick copper. The spring clip attaches to
just one of the socket tabs, but is at least
The base has is roughly finished
from the stamping process. The green thermal interface pad turns into a waxy substance once
heat is applied through the processor. The base is not perfectly smooth,
though it is generally flat over the area where the processor will come in contact
with the copper.