Abstract: This first edition of "What's New in
Cooling" started off as just a news post about the new Vantec heatsink and then one thing lead to another!
What's New in Cooling No. 1
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This first edition of "What's New in
Cooling" originally started off as a news post about the new Vantec heatsinks, and then
one thing lead to another and we ended up with four pages of heatsinks to look
over. Quite a few of the heatsinks we saw are for the AMD K8 processor. What is somewhat surprising is the level of force they
require - up to 75lbs. Intel will soon be changing its socket formfactor with Prescott yet again, and so another round of heatsinks will need to be built to support this upcoming processor - but
for the moment the socket 478 formfactor reins supreme.
Enjoy issue No. 1 of Frosty's What's New in
Cooling , there will undoubtedly
be many more to come as heatsink manufacturers continue to strive for
What is AeroFlow? As the Intel and AMD processors expended so fast, Vantec
R&D department keep innovates new technologies to fill the market needs and
provides better thermal solutions. Traditional heatsinks are designed with
cross sectional fins to remove the hot air that generated from the CPU and the
air flow out only from two sides of heatsink.
Unlike other traditional heatsinks, the AreoFlow designed with a
copper-core center to help absorbing the heat faster away from the CPU.
The unique four-side aluminum fins are designed with a slope inside the
heatsink. The purpose is to remove the heat smoothly from the center of
heatsink. This design is to ensure hot air will be removed from each
corner of the heatsink properly. It will yield a unique air circulation
around the heatsink and that's the reason why it's called AeroFlow.
From the Web:
KoreaMod has a
review of these
SATT and ZEROtherm heatsinks which I've never seen anywhere else before. The
common link between the two of them are the heatpipes, and many thin
radiator-like cooling fins.
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